Center image shows the actual internal condition of a PEM. Delamination is visible at the die paddle and some leadframe elements. The images at left and right show the same part with two different color maps applied. At left, the part has been made to look completely good. At right, the part has been made to look much worse than it really is. An understanding of the color map used and, preferably, of the echo waveforms at various locations, is necessary to accurate image interpretation. >click image for detail<
BGA Delamination
Moisture-induced delamination in a plastic-encapsulated BGA package. Image at left shows the mold compound to substrate interface. The bright white area represents delamination at this interface. Image at right is a through- transmission image of the same two devices. Delaminated region appears black in this image. >click image for detail<
Popcorn Cracking
“Popcorn cracking” in a plastic quad flat pack (PQFP). In the image at left, delamination of the mold compound from the paddle is shown by the red areas at center. The black region surrounding the paddle is a “shadow” cast by the package crack. The image at right shows a virtual cross-section of the package cracks, which can be seen extending upward from the paddle at a steep angle. >click image for detail<
Delamination in Rigid/Flex Board
Through-transmission image of multilayer rigid/flex boards following attachment of components. A good board is on the left and a bad one on the right, where the large black area is delamination at the rigid/flex interface. >click image for detail<
Leadframe Delamination in PEM
Acoustic image of plastic SOIC showing delamination of mold compound from leadframe (red areas in image at left). SEM image at right shows cross-section of the delamination.
SEM image courtesy of Hi-Rel Laboratories. >click image for detail<
Die Surface Delamination in PEM
Acoustic image of a PQFP showing delamination over a portion of the die surface and die paddle. >click image for detail<
Ceramic Chip Capacitor Delamination
Acoustic image of a ceramic chip capacitor mounted to a printed circuit board. Delamination along electrodes is visible at the top edge of the component. >click image for detail<
Moisture Sensitivity Level Testing
Moisture Sensitivity Level (MSL) testing of SOIC-8 devices. Images show pre-test (on left) and post-test (on right) condition of these parts. The delamination resulting from the test would cause the parts to fail the tested MSL level per J-STD-020. >click image for detail<
Substrate and Header
Acoustic image showing bond between a substrate and header. Voids appear white. Digital Image Analysis provides a quantitative measure of the amount of voiding, 4.5% in this case. >click image for detail<
Potentiometer X-Ray
X-ray images of a potentiometer showing a
bent contact. >click image for detail<
Solder Bridging in a BGA
Real-time x-ray image of a BGA device mounted to a printed circuit board. Excess solder is visible along the left edge, bridging adjacent solder balls. >click image for detail<
Coax Connector X-Ray
Real-time x-ray image of a coaxial cable connector. >click image for detail<
Counterfeit Component X-Ray
All of these plastic-encapsulated BGA devices were reported to be from a single production lot. Note that each contains a different substrate pattern. In #2 and #3, the bondwires are severely damaged. In #4, #5 and #6, no bondwires are present. >click image for detail<
Multilayer Ceramic Substrate
Subsurface crack in a multilayer ceramic substrate. The crack was not visible optically at low magnification (6X - 40X). >click image for detail<
Metal Lever
This is a metal lever, about 6" long. Red circular area at upper right is a cluster of porosity, which led to early failure in similar levers. >click image for detail<
The Difference A Color Map Makes
Center image shows the actual internal condition of a PEM. Delamination is visible at the die paddle and some leadframe elements. The images at left and right show the same part with two different color maps applied. At left, the part has been made to look completely good. At right, the part has been made to look much worse than it really is. An understanding of the color map used and, preferably, of the echo waveforms at various locations, is necessary to accurate image interpretation. >click image for detail<
BGA Delamination
Moisture-induced delamination in a plastic-encapsulated BGA package. Image at left shows the mold compound to substrate interface. The bright white area represents delamination at this interface. Image at right is a through- transmission image of the same two devices. Delaminated region appears black in this image. >click image for detail<
Popcorn Cracking
“Popcorn cracking” in a plastic quad flat pack (PQFP). In the image at left, delamination of the mold compound from the paddle is shown by the red areas at center. The black region surrounding the paddle is a “shadow” cast by the package crack. The image at right shows a virtual cross-section of the package cracks, which can be seen extending upward from the paddle at a steep angle. >click image for detail<
Delamination in Rigid/Flex Board
Through-transmission image of multilayer rigid/flex boards following attachment of components. A good board is on the left and a bad one on the right, where the large black area is delamination at the rigid/flex interface. >click image for detail<
Leadframe
Delamination in PEM
Acoustic image of plastic SOIC showing delamination of mold compound from leadframe (red areas in image at left). SEM image at right shows cross-section of the delamination.
SEM image courtesy of Hi-Rel Laboratories. >click image for detail<
Die Surface Delamination in PEM
Acoustic image of a PQFP showing delamination over a portion of the die surface and die paddle. >click image for detail<
Ceramic Chip Capacitor Delamination
Acoustic image of a ceramic chip capacitor mounted to a printed circuit board. Delamination along electrodes is visible at the top edge of the component. >click image for detail<
Moisture Sensitivity Level Testing
Moisture Sensitivity Level (MSL) testing of SOIC-8 devices. Images show pre-test (on left) and post-test (on right) condition of these parts. The delamination resulting from the test would cause the parts to fail the tested MSL level per J-STD-020. >click image for detail<
Substrate and Header
Acoustic image showing bond between a substrate and header. Voids appear white. Digital Image Analysis provides a quantitative measure of the amount of voiding, 4.5% in this case. >click image for detail<
Potentiometer X-Ray
X-ray images of a potentiometer showing a bent contact. >click image for detail<
Solder Bridging in a BGA
Real-time x-ray image of a BGA device mounted to a printed circuit board. Excess solder is visible along the left edge, bridging adjacent solder balls. >click image for detail<
Coax Connector X-Ray
Real-time x-ray image of a coaxial cable connector. >click image for detail<
Counterfeit Component X-Ray
All of these plastic-encapsulated BGA devices were reported to be from a single production lot. Note that each contains a different substrate pattern. In #2 and #3, the bondwires are severely damaged. In #4, #5 and #6, no bondwires are present. >click image for detail<
Subsurface crack in a multilayer ceramic substrate. The crack was not visible optically at low magnification (6X - 40X). >click image for detail<
This is a metal lever, about 6" long. Red circular area at upper right is a cluster of porosity, which led to early failure in similar levers. >click image for detail<