Acoustic Micro Imaging is a nondestructive technique that uses ultrasound in a frequency range of 10 MHz to 300 MHz to create an internal image of a sample. This technique is particularly sensitive to interfacial defects such as delamination, cracking or voids. Click here to learn more about acoustic micro imaging.
Component Types Inspected include:
• Plastic-encapsulated microcircuits (PEMs).
- SOIC, PQFP, BGA, TSOP
• Flip Chips
• Ceramic chip capacitors
• Hybrids
• Die attach or substrate attach samples
• Bonded wafers
• Printed circuit boards & flexible circuits
• Automotive sensors
• Medical Implantables
• Chip Scale Packages (CSPs)
• Component Screening
• Part Qualification
• Failure Analysis (FA)
• Destructive Physical Analysis (DPA)
• Moisture Sensitivity Classification
• RoHS/Pb-free conversion to Sn/Pb
• Materials evaluation and comparison
Commonly used synonyms for Acoustic Micro Imaging:
• AMI
• Scanning Acoustic Microscopy (SAM)
• C-SAM® (C-mode Scanning Acoustic Microscopy)
- registered trademark of Sonoscan, Inc.
• Ultrasonic testing
• Film
• Real-time x-ray (RTXR)
• Applications include:
- Inspection of BGA attachment
- MIL-STD-883 Method 2012 inspection
- Counterfeit component identification
- Lot screening
• External visual and photodocumentation
• Applications include:
- Lot screening
- Counterfeit component identification
• Schedule an AMI tutorial at your facility. Typical topics covered:
- AMI background
- Image interpretation
- Applications/Benefits
- Potential Pitfalls