analysis offers another effective non-destructive way to find flaws in
microelectronic parts and assemblies. It’s especially good at helping us…
- get a better look at die
attachments and wire bonding patterns,
- compare more precisely the wire
bonding patterns, paddle design, and die size of parts from different vendors
or with different date codes, and
- better identify die-attach voiding
and inconsistencies in wire-bond integrity, either of which can play a
significant role in decreasing product reliability.
these attributes, X-Ray analysis often is used in conjunction with other
investigative techniques, particularly C-SAM®. At AcousTech, we specialize in applying
X-Ray analysis to…
Chief among the standards for X-Ray analysis we
follow at AcousTech are:
addition to providing our clients with in-depth X-Ray analysis, we also give
them a concise but detailed report of our findings. Fast turnaround, personalized
care, and collaborative partnership are also hallmarks of our service.
questions about X-Ray analysis and its applications? We have answers. Just contact AcousTech. And if your need for one or
more of our X-Ray applications is immediate, Request
a Quote from us today.
C-SAM® is a registered
trademark of Sonoscan, Inc.