How is x-ray inspection used to help identify counterfeit components?

Counterfeit lots often contain a mixture of components that are different internally but appear identical externally. X-ray inspection is a quick and cost-effective method for identifying nonconforming or inconsistent internal construction features within a group of components. Differences in die size, bonding configuration, and leadframe design are easily visible in an x-ray image.  Click here for a x-ray mini case study showing different  internal substrate patterns shown in a x-ray inspection.

Also, see the case studies page for more examples.


What package types or devices can X-ray and C-SAM® be used on?

There are a myriad of devices that x-ray and C-SAM® can be applied to.  To see some specific case studies click here.

Specifically for C-SAM® the short answer is basically any device that is not constructed to have air gaps or is not round. A typical device would be a plastic encapsulated microcircuits (PEM's) where MSL testing could cause internal damage, or prior to doing a DPA, or to screen a particular lot for defects.  Other devices that are commonly scanned acoustically are ceramic capacitors, heatsink attachments, hybrids, or devices on PCB's.

As far as X-ray, PEM's are also fairly common. In addition to PEM's, devices that do contain gaps or are round in nature such as ceramic IC's and CAN or AXIAL devices are good x-ray candidates.  X-Ray is also ideal for finding broken or bent bondwires as well as potential counterfeit devices.
For more basic information on PEM's click here